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• The key process in encapsulation and sealing of semiconductor. • High-energy wafer laser cutting machine provides high precision and high efficiency, which require components with the same function like high precision and constant high speed. • As the core precision component, DDR motor and Linear Motor Module can perfectly meet its working requirement.

• Mechanical accuracy of DDR motor: <2um • Size requirement: short, low and light • Repeatability and resolution: correct the deviation of the wafer location with CCD, and realize precise repeatability when rotating every 90°